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Stres termiczny i odkształcenie w opakowaniach mikroelektroniki (elektrotechnika)–
US $20,70
Około79,18 zł
Stan:
Dobry
Książka, która była czytana, ale nadal jest w dobrym stanie. Na okładce widoczne są nieznaczne ślady używania, np. zadrapania, ale książka nie jest rozerwana i nie ma dziur. Przy książkach w twardej oprawie mogą brakować obwoluty. Większość stron jest nieuszkodzona tzn., że ewentualne zagięcia lub rozdarcia są sporadyczne, podkreślenia ołówkiem są minimalne i nie ma żadnych zaznaczeń markerem czy notatek na marginesach. Książka ma wszystkie strony. Aby poznać więcej szczegółów i opis uszkodzeń lub wad, zobacz aukcję sprzedającego.
Wysyłka:
Bezpłatnie Economy Shipping.
Znajduje się w: Simi Valley, California, Stany Zjednoczone
Dostawa:
Szacowana między Cz, 26 wrz a Pn, 30 wrz do 43230
Zwroty:
Zwrot w ciągu 30 dni. Za wysyłkę zwrotną płaci kupujący.
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Nr przedmiotu eBay: 145792330675
Ostatnia aktualizacja: 12-09-2024 18:51:39 CEST Wyświetl wszystkie poprawkiWyświetl wszystkie poprawki
Parametry przedmiotu
- Stan
- ISBN
- 9780442010584
- Publication Year
- 1993
- Format
- Hardcover
- Language
- English
- Book Title
- Thermal Stress and Strain in Microelectronics Packaging
- Illustrator
- Yes
- Publisher
- Springer
- Genre
- Technology & Engineering, Science
- Topic
- Industrial Design / Packaging, General, Electronics / General, Mechanics / Thermodynamics
- Item Weight
- 0 Oz
- Number of Pages
- Xxiv, 884 Pages
O tym produkcie
Product Identifiers
Publisher
Springer
ISBN-10
0442010583
ISBN-13
9780442010584
eBay Product ID (ePID)
221883
Product Key Features
Book Title
Thermal Stress and Strain in Microelectronics Packaging
Topic
Industrial Design / Packaging, General, Electronics / General, Mechanics / Thermodynamics
Publication Year
1993
Number of Pages
Xxiv, 884 Pages
Language
English
Illustrator
Yes
Genre
Technology & Engineering, Science
Format
Hardcover
Dimensions
Item Weight
0 Oz
Additional Product Features
LCCN
92-043285
Dewey Edition
20
Number of Volumes
1 vol.
Dewey Decimal
621.381046
Synopsis
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging., Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging."
LC Classification Number
TK7800-8360TK7874-7
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